Icheon, South Korea, May 2 (Reuters) - South Korea's SK Hynix 000660.ks Said on Thursday Its High-Bandwidth Memory (Hbm) Chips Used in AI Chipsets Are Almost Sold Out for 2025, After Their 2024 Chips Were Fully Booked.
韩国利川5月2日电（路透社）——韩国SK海力士 000660.ks 周四表示，其用于人工智能芯片组的高带宽内存（Hbm）芯片在2024年芯片已全部预订后，到2025年几乎售罄。
Chief Executive Officer Kwak Noh-Jung Said the Nvidia Supplier and the World's Second-Largest Memory Chipmaker Will Begin Sending Samples of the Latest Version of Hbm Chips, Called 12-Layer Hbm3E, in May and Begin Mass Producing Them in the Third-Quarter.
首席执行官Kwak Noh-Jung表示，Nvidia供应商和全球第二大存储芯片制造商将在5月开始发送名为12层Hbm3E的最新版本的Hbm芯片样品，并在第三季度开始批量生产。
Kwak Said Its Hbm Products This Year Had Already Sold Out, While 2025 Hbm Volumes Were Almost Sold Out Amid a Rapid Expansion of AI Technology Into a Wider Range of on-Device Applications Such as Smartphones, Pcs, and Automobiles.
Kwak表示，其Hbm产品今年的Hbm产品已经售罄，而在人工智能技术迅速扩展到智能手机、个人电脑和汽车等更广泛的设备端应用的情况下，2025年的Hbm销量几乎售罄。
(Reporting by Joyce Lee and Heekyong Yang
Editing by Ed Davies)
（Joyce Lee 和 Heekyong Yang Yang 报道）
由 Ed Davies 编辑）