TSMC and Tesla Tesla collaborate on 3nm chips to help upgrade Tesla's FSD Smart Drive technology

TSMC will see a significant increase in the number of 3nm NTO chip design finalizations next year, and Tesla will also become an N3P customer, which is expected to produce next-generation FSD Smart Driver chips.

TSMC's N3P process, which is scheduled to go into production in 2024, offers a 5% performance boost, a 5% to 10% reduction in power consumption, and a 1.04x increase in chip density compared to N3E. TSMC said N3P's PPA cost and technology maturity are better than Intel's 18A process.

Tesla has placed several orders with TSMC, such as the 7nm process Dojo D1 chip and the 5nm process HW 4.0 chip. With the fifth-generation FSD chips on TSMC's N3P list, Tesla is expected to become TSMC's seventh largest customer, bringing new momentum to its revenue growth.

Tesla's FSD (Full Self-Driving) Smart Driving technology is one of the industry's leading autopilot technologies, and this partnership with TSMC will further enhance its technology. the high performance and low power consumption of the 3nm chips will provide Tesla's FSD system with greater computing power and lower energy consumption, helping to improve the range and performance of Tesla's electric vehicles.

The partnership also reflects TSMC's leadership in semiconductor manufacturing. As the world's leading semiconductor foundry, TSMC will continue to dedicate itself to the development and production of high-performance, low-power chips to meet the growing market demand. $Taiwan Semiconductor(TSM.US)$ $Direxion Daily Semiconductor Bull 3x Shares ETF(SOXL.US)$