Not Just Intel: Entire Supply Chain Enters Frenzy After Nvidia's Partnership

Thursday's significant rise in the SOX index suggests that Nvidia's gamble not only profits Intel but also promises benefits for the entire supply chain due to increased industry CapEx expectations. $Intel (INTC.US)$ 's manufacturing involves chip design software, semiconductor equipment, semiconductor materials, and packaging and testing phases, where related companies saw significant stock price increases yesterday, including a 12.86% rise for $Synopsys (SNPS.US)$ and a 9.54% increase for $Amkor Technology (AMKR.US)$ .

Semiconductor supply chain
The semiconductor supply chain is a highly specialized global network, ranging from upstream design to downstream applications, involving multiple stages.
Chip Design (EDA, Electronic Design Automation): Uses software tools to simulate and optimize chip architecture, ensuring functionality and performance meet requirements.
Semiconductor Equipment: Provides the precision machinery needed for chip manufacturing, such as lithography machines, etching machines, and deposition equipment, used for processing silicon wafers. The semiconductor materials stage supplies key raw materials, including silicon wafers, chemical gases, photoresists, etc., supporting the stability and purity of the manufacturing process.
Wafer Fabrication (Foundry): This is the core step that transforms designs into physical chips, etching circuits on silicon wafers through processes like lithography and doping.
Packaging: Encapsulates bare chips into usable components, adding pins and protective layers to enhance durability and connectivity.
Testing: Verifies the functionality, performance, and reliability of chips through automated equipment, eliminating defective products to ensure quality control.

Here is a list of semiconductor manufacturing supply chain companies:
$ASML Holding (ASML.US)$ : The company's supply ccounts for 14.1% of Intel's costs. Intel relies on ASML's lithography machines for the photolithography step in chip manufacturing, a crucial step that determines the precision and performance of the chip circuit patterns. The lithography machine projects the circuit design patterns onto a silicon wafer coated with photoresist, laying the foundation for subsequent etching and deposition processes.
$Applied Materials (AMAT.US)$ is Intel's second-largest equipment supplier, providing various semiconductor manufacturing equipment and related services, including thin-film deposition, etching, and ion implantation. In Intel's chip manufacturing process, Applied Materials' equipment is used to build different layer structures of the chip, performing material removal or addition operations, which significantly impact the chip's performance and yield. The company has been continuously selected into Intel's list of quality suppliers for several years.
$Tokyo Electron (8035.JP)$ , $KLA Corp (KLAC.US)$ , and $Lam Research (LRCX.US)$ are also important suppliers to Intel, accounting for 6.59%, 3.66%, and 3.11% of Intel's costs, respectively. KLA Corporation focuses on inspection and measurement equipment used in the semiconductor manufacturing process. Intel uses KLA's equipment to detect and measure wafer surface defects, pattern dimensions, and film thickness, promptly identifying problems in the manufacturing process to ensure the chip manufacturing's yield and quality.
$Micron Technology (MU.US)$ : As a giant in memory chips, it provides Intel with various storage chips, such as DDR memory chips and NAND flash memory chips, used in Intel's computers, servers, and data centers to meet data storage and rapid retrieval needs.
Additionally, $Synopsys (SNPS.US)$ , a renowned chip design software company, also collaborates extensively with Intel. In 2025, Synopsys announced that its EDA process and IP portfolio for Intel's 18A and 18A-P technology nodes could help designers accelerate the development of high-performance chip designs.
$Amkor Technology (AMKR.US)$ : Although Intel, as a giant in chip design and manufacturing, has its own packaging and testing business, it collaborates with Amkor Technology under various circumstances. The company masters several advanced packaging technologies, such as Fan-Out Wafer-Level Packaging (FOWLP) and 2.5D/3D packaging. When developing high-performance computing chips with special packaging requirements, Intel leverages Amkor Technology's advanced packaging technologies to achieve smaller chip sizes, higher performance, and better heat dissipation characteristics.
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74128907 :
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Magisrich : also never see Nvidia fly
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