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Micron Technology starts mass production of HBM3E memory to be used in NVIDIA H200 AI chips

Micron Technology has begun mass production of high-bandwidth memory (HBM) for NVIDIA's latest artificial intelligence chip. Micron Technology's HBM3E products will reportedly be supplied to NVIDIA and will be used in NVIDIA's H200 Tensor Core GPU, which is expected to begin shipping in the second quarter.

"Micron Technology has achieved the trifecta with this HBM3E milestone: time-to-market leadership, best-in-class industry performance, and a differentiated energy efficiency profile," said Sumit Sadana, executive vice president and chief commercial officer, Micron Technology." "AI workloads rely heavily on memory bandwidth and capacity, and Micron Technology is well-positioned to support the significant growth of AI in the future with our industry-leading HBM3E and HBM4 roadmaps and our complete portfolio of DRAM and NAND solutions for AI applications."

HBM is one of Micron Technology's most profitable products, in part because of the technical complexity involved in its construction. Micron Technology has previously said it expects HBM revenues to reach "hundreds of millions" of dollars in fiscal year 2024 and continue to grow through 2025, said Anshel Sag, analyst at Moor Insights & Strategy, "I think this is a I think this is a huge opportunity for Micron Technology, especially because of the growing popularity of HBM for AI applications." $Hudbay Minerals(HBM.US)$ $Micron Technology(MU.US)$ $NVIDIA(NVDA.US)$
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