How does the "high-NA" EUV differ from ASML's current version of EUV?
The main difference between high-NA extreme ultraviolet, or high-NA EUV lithography, and Asmac's current standard EUV lithography is the use of a larger numerical aperture. high-NA EUV technology utilizes a 0.55 NA lens, which is capable of achieving 8 nm resolution, whereas standard EUV technology uses a 0.33 NA lens. The standard EUV technology uses a 0.33 NA lens. As a result, this new NA technology is able to print smaller feature sizes on wafers, which is critical for chip fabrication technologies at the 2nm and below node.
In addition to the collaboration with Intel, Asmax is working with a wider range of partners in an effort to spread the popularity of high-NA EUV lithography. The New York State government recently announced a $10 billion investment in a new High NA EUV center at the Albany Nanotechnology Complex in partnership with industry players such as IBM and Micron Technology.
It is reported that IBM, the old US tech giant, will play an important role in this new center above, using the new High NA EUV machine to produce more advanced chips.
In addition, members of the center, including semiconductor equipment giants Tokyo Electron from Japan and Applied Materials, a leader in semiconductor equipment in the U.S., as well as international partners such as Japan's Rapidus Chip Company, will also be able to use the new Asmac EUV lithography machine for research.
Rapidus, the "Japanese version of TSMC," has already received billions of dollars in funding from the Japanese government, and is backed by household names in Japan such as the Sony Group and Toyota Motor. The company is planning to mass-produce 2nm logic chips by 2027.
If Rapidus succeeds, it would represent a generational leap in technology for Japan, whose chip-making capabilities stagnated decades ago at the current 40-nanometer node. Japanese Prime Minister Fumio Kishida has pledged "maximum support" to Rapidus to keep the joint venture on track. $Intel(INTC.US$ $ASML Holding(ASML.US$ $IBM Corp(IBM.US$ $Taiwan Semiconductor(TSM.US$
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