Nvidia to embrace TSMC 3D SoIC tech
Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according to sources in the IC backend market. $Taiwan Semiconductor(TSM.US$
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搞经济 抄底 加仓 : Careful, Wallstreet is lowering down the EPS as to bring the stock price up for the next EarningsCall. Trade wise , Trade smart (TSMC) $Taiwan Semiconductor(TSM.US)$