Rush advanced packaging,Intel and Samsung are in a hurry.

In early March, ten giants including $Intel(INTC.US)$ . $Taiwan Semiconductor(TSM.US)$ . Samsung and $Asante Gold Corp(ASE.CA)$ announced the establishment of a universal chip interconnection standard - UCle, to standardize Chiplet technology. This standard also provides specifications at the "advanced packaging"level. covering all hiah-density silicon bridge-based technologies such as EMIB and InFO.